| Process | Ability and accuracy | |
| Photoresist coating | Spin coating | Glue thickness accuracy≤3%(Applicable to plane) |
| Photoresist coating | Spin coating | Glue thickness accuracy ≤10%(Suitable for flat/concave surface) |
| Photolithography | Accuracy 2umRegistration accuracy: 0.15um | |
| Development | Accuracy 2umDevelopment uniformity <5% | |
| Etching | Size dispersion ±1um | |
